![]() It runs the Android 9 Pie OS, with a promise to upgrade to the latest Android 10 by 2Q 2020. The module is designed for advanced robotics, drones and embedded IoT devices requiring the latest on-device AI powers, says Intrinsyc. It’s supported by a Mini-ITX form-factor Open-Q 845 μSOM development kit. The new Open-Q 845 uSOM is a 50mm × 25mm mini-module is based on Qualcomm’s Snapdragon 845 SoC ( Figure 1). Over the last 12 months, new solutions along those lines continue to roll out from a variety of vendors ranging from processor companies to drone vendors themselves.Įxemplifying those trends, in October Intrinsyc announced its tiny Open-Q uSOM module. A rich set of resources are available including board-level solutions, payload subsystems and development kits and even complete reference designs. Meanwhile, huge opportunities abound for drone platforms that can pack in high levels of compute processing along with advanced cameras and sensor suites.įortunately, drone developers don’t have to start from scratch. ![]() Faced with severe limits on size, weight and power, drone designers need to be careful with how they choose each and every electronic component. ![]() The development of consumer and commercial drones continues to be a dynamic segment of the embedded systems industry.
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